Material: FR4, 1.0mm
Surface: O. S. P
Apply to: Telecommunication
FPCB production capabilities:
Layer count: Single & Double-sided and multilayer (3~6Layer)
Base material: PI, PE, PET
Thick. Of base copper: 12μm, 18μm, 35μm, 70μm
Largest Panel Size: 400mm x 600mm
Minimum hole dimension:
**Drilling(P. T. H. ): Φ0.2mm
** Punching: Φ0.5mm
PTH tolerance: +/-0.1mm
NPTH tolerance: +/-0.05mm
Minimum line width: 0.1mm
Minimum line space: 0.1mm
Surface treatment: Immersion Gold/Tin/Silver, Gold Plating, OSP
Profile treatment: V-Cut, punching and milled
|
Click to enlarge image
Related Keywords:
Bookmark / Share this page